Hughes Cain & Associates

Printed Circuit Board Capabilities

Off Shore since 2002

We can provide life-of-the-part coverage from prototypes, to preproduction
to volume, thereby saving tool costs and developing an intimate
knowledge of the part number, which in turn will produce higher yields and
lower costs.

Our quality acceptance is greater than 99%. If we must rebuild a part, it
goes ahead of production orders as our suppliers are committed to giving us top
priority in rebuilds.

We are the fastest growing independent board supplier in the world. No one has
the buying power. No one has our delivery and quality influence ,and no one has the in-house controls at our vendor partners that we do.

There is no better way to globally source your PCBs.

Capabilities

  • Rigid boards Up To 40 layers
  • Flex boards up to 22 layers/
  • Rigid Flex up to 12 layers
  • HDI boards including blind and buried vias, via on pad, and filled vias
  • Aluminum base boards single and multilayer
  • Back Planes
  • Load and Test boards
  • High Frequency and RF boards including Teflon and hybrid materials
  • Imbedded resistors and capacitors
  • Thermal management boards
  • Coin boards
  • TS 16949, ISO 9001, ISO 14001, RoHS & REACH

Finishes

  • Soft gold
  • Hard gold
  • OSP
  • ENIG
  • HAL
  • LF HAL
  • Immersion tin
  • Immersion silver
  • ENEPIG

On Shore since 1987

We are Mil-Spec approved, MIL-PRF-31032 Qualified, MIL-PRF-55110 Qualified, AS9100 Rev D Certfied, ITAR Registered & ISO 9001:2008 Certified . We offer expertise in advanced materials such as Teflon, Duroids, and various Hybrid configurations.

Premier Customer Service
We consider it a true privilege to serve our customers. We have worked hard to develop great customer relationships. We will
continue working as a team with customers to maintain a relationship you can depend on.

  • 24-Hour Quickturns (2-16 Layers)
  • Up to 30 Layers in 72 Hours
  • 5 Day Standard Turns
  • Blind and Buried Via's
  • Silver/Epoxy Filled Via's
  • Impedance Modeling and Testing
  • 3/3 Lines and Spaces
  • .002 Core Processing
  • High Aspect Ratio Planning
  • Board thickness up to .187
  • Full Body Nickel/Gold
  • Immersion Silver
  • Electroless Nickel Immersion Gold (ENIG)
  • HASL (Leaded)
  • Industry Standard Materials
  • Specialty Materials
  • Sequential Lamination Construction
  • Filled Via’s (In-House)
  • Flex Circuits
  • IPC 6012 Class 1-3
  • ISO 9001:2008 Certified
  • AS9100 Rev D Certified
  • MIL-PRF-31032 Qualified
  • MIL-PRF-55110 Qualified
  • ITAR Registered